As liquid-cooled AI data centers scale at hyperscale speed, Rob Lowe argues that long-term reliability, cost control, and ...

TE Connectivity offers a range of connectivity and sensor systems that it has tested in some of the harshest environments.

“Photon Design's next-generation, EPIPPROP simulator, will offer the flexibility to split waveguides, simulating this process ...

A new 12-kW reference design for high-performance power-supply units (PSUs) from Infineon Technologies is specifically designed for AI data centers and server applications. The reference design uses a ...

SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ listing, announced today that it ...

By applying machine learning techniques, engineers at MIT have created a new method for 3D printing metal alloys that produce parts far stronger than those made using traditional manufacturing ...

Unexpected change rewards those who are quick to adjust, but all aspects of a system must be adjusted to keep growth going.

Materials informatics combines data analytics and engineering design, streamlining material development and enhancing ...

Jachin Ramirez graduates after helping develop cooling tech aimed at reducing power use in fast-growing data centers ...

As demand shifts from general-purpose semiconductors toward AI ASICs, SEMIFIVE provides customized chip development solutions ...

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

This surge in semiconductors during 2026 is likely powered by rising demand for high-performance chips in AI systems, ...