Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of ...

From the moment we are born, our brains are bombarded by an immense amount of information about ourselves and the world around us. So, how do we hold on to everything we've learned and experienced?

At the SK AI Summit 2025 in Seoul on November 3, 2025, SK Hynix CEO Kwak Noh-jung announced a major strategic overhaul, revealing plans to transform the South Korean memory maker from a traditional ...

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

Micron has announced it's now shipping its fastest and highest-capacity high-bandwidth memory (HBM) yet, its second-generation HBM3, called HBM3e. The company's newest memory modules feature a record ...

Forward-looking: Major chipmaking companies have been trying to stack different kinds of silicon components onto each other for quite some time. Now, Samsung is apparently ready to debut a significant ...